Heat Thermal Paste-Syringe

Thermal Paste, thermal Grease,compound Features: *Thermal conductivity of the grease reachS 0.8-1.8W/mK; *Under 300 °C temperature conditions is non-hardening, no flow, good temperature persistance; *Thermal paste is fully in line with the targets of the international SGS requirements. Effectiveness and USE: 1. Used as a heat transfer medium of electronic components which can enhance the efficency of the heat conduction. 2. For the better heat conduction between cpu and heatsink and enlong the life of cpu. 3. Filling in gaps when High-power transistors connect with aluminum, copper accessory. 4. Reduce the operate Heat of various of Thermal Dissipation elements to guarantee their Normal operation. This product's storage period is 1 year (25 °C below). These products are non-dangerous goods, according to general chemical transport. ParameterunitsconditionTest MethodTest ResultColorN/A25°cVisualGREYThermal ConductivityW/m-KNoROCT8.140-82>0.965Thermal Impedance°c -in2/W25°cASTM D1470<0.225Specific GravityN/A25°cASTM D1475>2.3Evaporation%150°c /24HoursFed.Std.791<0.001Bleed%150°c /24HoursFed.Std.792<0.05Moment beared temperatur°cN/AN/A-50 240°cOperation Temperture°cN/AN/A-30 180°c